Transistor sizing analysis of regular fabrics

This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several evaluation methods have been exploited, such as DC simulations, ring oscillators and single-gate open chain structures. Different design aspects are addressed taking into account stacked transistors, cells with drive strengths and circuit critical paths. The performance degradation of using regular fabrics in comparison to standard cells is naturally expected, but it is quite important to evaluate the dimension of such impact. The results were obtained for predictive PTM45 CMOS parameters, and the conclusions can be easily extrapolated to other technology nodes and fabrication processesPostprint (published version

Transistor sizing analysis of regular fabrics

This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several evaluation methods have been exploited, such as DC simulations, ring oscillators and single-gate open chain structures. Different design aspects are addressed taking into account stacked transistors, cells with drive strengths and circuit critical paths. The performance degradation of using regular fabrics in comparison to standard cells is naturally expected, but it is quite important to evaluate the dimension of such impact. The results were obtained for predictive PTM45 CMOS parameters, and the conclusions can be easily extrapolated to other technology nodes and fabrication processe

Transistor sizing analysis of regular fabrics

This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several evaluation methods have been exploited, such as DC simulations, ring oscillators and single-gate open chain structures. Different design aspects are addressed taking into account stacked transistors, cells with drive strengths and circuit critical paths. The performance degradation of using regular fabrics in comparison to standard cells is naturally expected, but it is quite important to evaluate the dimension of such impact. The results were obtained for predictive PTM45 CMOS parameters, and the conclusions can be easily extrapolated to other technology nodes and fabrication processe

Type approval of marine equipment (UK nominated bodies) Notice to manufacturers, shipbuilders, shipowners, ship operators and managers, designers and marine consultants, masters and officers of merchant ships

SIGLEAvailable from British Library Document Supply Centre-DSC:5678.984(1735MF) / BLDSC - British Library Document Supply CentreGBUnited Kingdo

Logic synthesis for manufacturability considering regularity and lithography printability

This paper presents a novel yield model for integrated circuits manufacturing, considering lithography printability problems as a source of yield loss. The use of regular layouts can improve the printability of IC layouts, but it results in a significant area overhead by introducing regularity. To the best of our knowledge, this is the first approach that considers the tradeoff of cells with different levels of regularity and different area overheads during the logic synthesis, in order to improve overall design yield. A technology remapping tool with such yield model as cost function is proposed and implemented and interesting results are presented.Peer Reviewe

Resumos em andamento - Engenharia Química

Resumos em andamento - Engenharia Químic

Resumos em andamento - Engenharia Química

Resumos em andamento - Engenharia Químic